CMOS Front Ends for Millimeter Wave Wireless Communication by Noël Deferm, Patrick Reynaert

By Noël Deferm, Patrick Reynaert

This e-book specializes in the improvement of circuit and method layout strategies for millimeter wave instant communique structures above 90GHz and fabricated in nanometer scale CMOS applied sciences. The authors reveal a hands-on method that was once utilized to layout six diversified chips, on the way to conquer various layout demanding situations. habit of either actives and passives, and the way to layout them to accomplish excessive functionality is mentioned intimately. This booklet serves as a invaluable reference for millimeter wave designers, operating at either the transistor point and method point.

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4) 38 3 Passive Devices: Simulation and Design Fig. 4 High Characteristic Impedance Transmission Line Another change to the differential microstrip line is to completely remove the ground shield (Fig. 4b). Removing the shield of the line reduces the capacitance per unit length. From Eq. 1 it is clear that a lower capacitance per unit length results in a higher characteristic impedance. This transmission line with high characteristic impedance can be useful when certain impedance transformation ratios are targeted.

10 at 120 GHz for a 12 µm, 12 finger MOS capacitor) will result in gain loss. Therefore, in technologies where more gain is available from the nMOS transistors commended. 3 Conclusion In this chapter, the performance of nanometer-scale CMOS technologies at mmwave frequencies was discussed. It became clear that despite the evolution of the transistors, the performance of a single MOSFET is still limited, so advanced analog and RF design techniques are required. Low available gain of the nMOS is one of the most restrictive properties which has a severe impact on all other design parameters.

To make a fair comparison with the previously discussed planar and stacked transformer, a comparable layout is used (Fig. 20a). The two primary windings are designed in the same top metal layer. 4 Transformers 51 Z s ZL a b 10GHz 94GHz Fig. 20 Layout (a) and source and load impedance under conjugate match as a function of frequency on a 50 Smith chart (b) of the stacked transformer with two secondary windings. The diameter of the primary winding is 50 µm, the outer secondary winding is 56 µm, the inner secondary winding is 44 µm and the trace width is 4 µm of 44 µm.

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CMOS Front Ends for Millimeter Wave Wireless Communication by Noël Deferm, Patrick Reynaert
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